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Resonac to Form Japan-U.S. Consortium for Chip Back-End Technologies

Resonac to Form Japan-U.S. Consortium for Chip Back-End Technologies

   Tokyo, July 8 (Jiji Press)--Resonac Holdings Corp. said Monday it will set up a consortium comprising 10 Japanese and U.S. semiconductor materials and equipment companies in Silicon Valley to develop technologies for the back-end process in semiconductor manufacturing.
   Six companies from Japan, including Resonac, formerly Showa Denko K.K., and Tokyo Ohka Kogyo Co., and four from the United States will join the consortium, US-JOINT, said Resonac, which has expertise in materials for the back-end process.

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AFP-JIJI PRESS NEWS JOURNAL


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