Da Nang to open $68.8mn semiconductor packaging lab by end-2026
Da Nang City in central Vietnam will begin operating a VND1.8-trillion (US$68.8 million) advanced packaging technology laboratory by the end of 2026, the project’s investor said on Monday.
VSAP LAB JSC, the project’s developer, said the facility will be built at the Da Nang IT Park No. 2, near the Thuan Phuoc Bridge.
The lab will be constructed on a 2,288-square-meter site, with a total floor area of more than 5,700 square meters.
The facility will include two main areas: a laboratory for research and development of new semiconductor packaging technologies, and a fabrication zone (Fab) for trial production using real wafers and international-standard equipment, including lithography, wafer bonding, and testing systems.
The project is designed to produce up to 10 million units per year for domestic and international markets, the company said.
Speaking at the project’s launch ceremony, Vietnam’s Minister of Science and Technology Nguyen Manh Hung said the lab would play a strategic role in helping the country integrate more deeply into the global semiconductor supply chain.
He emphasized the importance of packaging and testing in semiconductor manufacturing.
The project is a public-private partnership model, intended to serve as a center for innovation, workforce training, investment attraction, and technology transfer, according to the Ministry of Science and Technology.
The ministry said it would support Da Nang in developing research infrastructure and in connecting the lab with national and international programs in semiconductor packaging, design, and testing.
Bao Anh - Thai Ba Dung / Tuoi Tre News
(2025/07/28-17:15)
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